カテゴリー

Various sizes and materials
to meet all needs

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Applications
Automobile manufacturing equipment parts,
semiconductor-related manufacturing equipment,
aerospace-related parts, etc.
Form of delivery
Forged products (block shape)
Material properties (example of measurement)

Classification:
High-carbon LEX

Properties:
High temperature resistance

Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) 3.5〜4.5※ Expansion (%) 25
Lower limit of application temperature (℃) -30 Hardness (HB) 135
0.2% yield strength (N/mm2) 280 Young’s modulus (GPa) 135
Tensile strength (N/mm2) 440 Thermal conductivity W(/ m・K) 13.0
Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) 3.5〜4.5※
Expansion (%) 25
Lower limit of application temperature (℃) -30
Hardness (HB) 135
0.2% yield strength (N/mm2) 280
Young’s modulus (GPa)
135
Tensile strength (N/mm2) 440
Thermal conductivity W(/ m・K) 13.0
  • *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
  • *Young’s modulus is measured using the ultrasonic pulse method.
  • *Contents are subject to change without notice.

画像
Applications
Automobile manufacturing equipment parts,
semiconductor-related manufacturing equipment,
aerospace-related parts, etc.
Form of delivery
Cast product
Material properties (example of measurement)

Classification:
High-carbon LEX

Properties:
High temperature resistance

Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) 3.5〜4.5 Expansion (%) 15
Lower limit of application temperature (℃) -30 Hardness (HB) 135
0.2% yield strength (N/mm2) 260 Young’s modulus (GPa) 135
Tensile strength (N/mm2) 440 Thermal conductivity W(/ m・K) 13.0
Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) 3.5〜4.5
Expansion (%) 15
Lower limit of application temperature (℃) -30
Hardness (HB) 135
0.2% yield strength (N/mm2) 260
Young’s modulus (GPa)
135
Tensile strength (N/mm2) 440
Thermal conductivity W(/ m・K) 13.0
  • *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
  • *Young’s modulus is measured using the ultrasonic pulse method.
  • *Contents are subject to change without notice.