カテゴリー

Various sizes and materials
to meet all needs

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Applications
Semiconductor-related manufacturing equipment, etc.
Form of delivery
Cast product
Material properties (example of measurement)

Classification:
High-carbon LEX

Properties:
Optimum low thermal expansion coefficient can be selected from a range of 1×ppm/℃ or less or 1 to 6×ppm/℃, castability, machinability, and low temperature stability

Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) 3.0〜4.0 Expansion (%) 15
Lower limit of application temperature (℃) -250 Hardness (HB) 135
0.2% yield strength (N/mm2) 250 Young’s modulus (GPa) 130
Tensile strength (N/mm2) 430 Thermal conductivity W(/ m・K) 14.5
Average coefficient of thermal expansion x ppm/℃ (10 to 40℃) 3.0〜4.0
Expansion (%) 15
Lower limit of application temperature (℃) -250
Hardness (HB) 135
0.2% yield strength (N/mm2) 250
Young’s modulus (GPa)
130
Tensile strength (N/mm2) 430
Thermal conductivity W(/ m・K) 14.5
  • *Data other than the average coefficient of thermal expansion are examples of measurements and are not guaranteed.
  • *Young’s modulus is measured using the ultrasonic pulse method.
  • *Contents are subject to change without notice.